The bombarded solid is the raw material for depositing thin films by sputtering method, which is called the sputtering target. (Here is a great blog for more information about this
physical vapor deposition tehcnique)Various types of sputtered thin films have been widely used in semiconductor integrated circuits, recording media, planar display and surface coating of workpieces. The high temperature and high vacuum environment inside the process reaction chamber can make these metal atoms form grains, and then through the micro image patterning and etching, the final layer of metal wires, and the chip data transmission depend on these metal wires.
There are multiple typles of techniques to make sputter tarigets. For metal sputter targets, induction melting is the most popular method to make them. However, for some metals with high melting point and ceramic targets, hot pressing is applied. In this case, the powder form raw material is packed in a mold and sintered in high temerature with high pressure. Check
here to learn more information about hot pressing method in sputter target producing.
Sputtering targets are mainly used in electronic and information industries, such as integrated circuit, information storage, liquid crystal display, laser memory, electronic controller, etc.; they can also be used in the field of glass coating; they can also be used in wear-resistant materials, high-temperature corrosion resistance, high-grade decorative products and other industries. Check for more information about
sputter targets material.